公司先后与超过1,000家高科技研发、制造和服务企业进行合作,产品应用于通信、消费电子、汽车、医疗、工业物联网、Ai人机交互、航空航天、军工行业、智能家居等领域, 资源遍及全球三十多个国家和地区。
Integrity wins the world, quality creates the future!
Shenzhen Cabol Technology Co., Ltd. (hereinafter referred to as "Cabol") was founded on May 1, 2009.
Since its inception, it has been focusing on the research, development, design, production and sales of FPC flexible circuit boards, which is a high-precision and high-quality integrated company.
The products are widely used in various fields such as mobile communication, smart home, optoelectronics, industrial control, medical equipment, automobiles, and consumer electronics.
Cabol has established domestic and international marketing departments, and its products are exported to global markets such as Germany, the United States, Australia, Sweden, Japan, etc. We are committed to providing customers with more convenient and fast services!
“助力电子科技持续创新”
“全球先进电子电路方案数字制造领军者”
“顾客为先,高效可靠,持续创新,共同成长”
FPC软板
FPC软板
HDI盲埋孔
层数/板厚: 4-20层/0.4-3.0MM
孔径: ≥0.10mm-0.15mm
表面处理: 喷锡/沉金/OSP/沉银/沉锡/电金
盲埋阶数: 1-4阶;任意阶;
填孔方式: 树脂填孔(真空树脂塞孔)/电镀填孔(VCP自动填孔线,进口填孔药水)
产品类型: FR4 HDI盲埋/高频板材+FR4 HDI盲埋/纯高频材料HDI盲埋 ;
样板、批量均可接;
HDI盲埋孔
高精密阻抗板
层数/板厚/铜厚: 2-20层/0.2-3.0MM/1-3oZ
线宽/线距: min 3/3mil
孔径: ≥0.15mm
阻值范围: 50-125Ω
阻值公差: +/-10%
产品类型: 普通FR4阻抗板;高频阻抗板;高频+FR4混压阻抗板;
备注:我司可提供阻抗测试条及阻抗测试报告;
高精密阻抗板
铜基/铝基板
层数/板厚/铜厚: 1-2层/0.8-3.0MM/1-10oZ
导热系数: 1-3W(高导热绝缘胶)
表面处理: 喷锡/沉金/OSP
产品类型: 普通单面铜/铝基;双面混压FR4+铜/铝基;
双面夹芯铝基;热电分离铜/铝基;
铜基/铝基板
铜基/铝基板
层数/板厚/铜厚: 1-2层/0.8-3.0MM/1-10oZ
导热系数: 1-3W(高导热绝缘胶)
表面处理: 喷锡/沉金/OSP
产品类型: 普通单面铜/铝基;双面混压FR4+铜/铝基;
双面夹芯铝基;热电分离铜/铝基;
铜基/铝基板
铜基/铝基板
层数/板厚/铜厚: 1-2层/0.8-3.0MM/1-10oZ
导热系数: 1-3W(高导热绝缘胶)
表面处理: 喷锡/沉金/OSP
产品类型: 普通单面铜/铝基;双面混压FR4+铜/铝基;
双面夹芯铝基;热电分离铜/铝基;
铜基/铝基板